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| Processor Sockets | |||
| Processor Cores | |||
| Partitions per Device | |||
| Memory | |||
| Device I/O Bandwidth | |||
| External I/O Connectivity | |||
| Ethernet Ports | |||
| PCI-E or PCI-X slots | |||
| Bypass ports (pairs) |
The F7 OptimalAoS-2201-5700 device brings a new level of networks device I/O capabilities to industry-standard Optimal series products with 32GB/s of device I/O bandwidth and 52GB/s of external I/O connectivity. The OptimalAoS-2201-5700 device has four 8GB/s HyperTransport links dedicated to device I/O delivering up to 32 GB/s of aggregated device I/O bandwidth. The hardware-accelerated OQ-par(tm) partitioning delivers industry-leading performance with the reliability of redundant and fault-isolated I/O.
The F7 OptimalAoS-2201-5700 Application Optimization Device supports up to 52 GB/s of external I/O connectivity. Each of the four external I/O channels supports two 1Gbps Ethernet RJ45 ports, two PCI-E slots, two pairs bypass channel.
The OptimalAoS-2201-5700 meets the RAS requirements for enterprise-class application optimization device with dual-redundant, hot-swappable power and cooling. Power modules are easily accessible from outside the chassis. Fans are accessible from a top cover and can be replaced while the chassis is rack-mounted. Processor and memory modules that are not part of a partition may be hot-plugged while the chassis is rack-mounted.
| Memory Scrubbing
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Two pairs of redundant fans
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Hot-swappable fans
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| Four separate device I/O chains
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Two pairs of redundant power supplies
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Hot-swappable power supplies
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| Variable speed fans
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Electrically fault-isolated partitions
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Front-side, in-rack removable Processor and Memory modules
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| Bypass
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HA (AA and AS)
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In-rack replaceable memory
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| Power supplies
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PCI card replacement in "downed" partition |
Hot-swappable PCI slots
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| ECC memory
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Four separate 120v power cords
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Front-side, in-rack removable and hot-swappable flash
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| Reduced chip sets
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Field-upgradeable and replaceable device I/O board
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